'bsp' 검색 결과

Use when you need to rebuild the BSP overlay — DT, OOT modules, or kernel — from changes under bsp_sources/. Triggers: build bsp, rebuild dtb, rebuild kernel.

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Draft prospect emails and follow-up sequences using the sender’s established writing style and specific facts about each recipient. Present messages for approval, prepare approved sends when connected, and record contact history in HubSpot or a file.

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• Draft a cold email in the sender’s own style
• Prepare outreach to a referred prospect
• Write follow-ups after a customer meeting

Use to promote overlay files and built artifacts into the staged BSP image. Do NOT use to flash or build. Triggers: promote bsp image.

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Use when you need to print Jetson BSP info (L4T version, board configs, rootfs state) from a Linux_for_Tegra root on the host PC. This is an example skill.

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Use to flash a promoted BSP image to a Jetson DUT in RCM mode via flash.sh or l4t_initrd_flash.sh. Do NOT use for BSP customization, image promotion, or carrier derivation.

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Use after jetson-flash-image to run static BSP checks, on-target smoke/regression tests on a flashed DUT, or both. Not for build or flash steps. Triggers: validate bsp, on-target validation.

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Download NVIDIA Jetson Linux BSP artifacts (BSP tarball, sample rootfs, public_sources, x-tools, guides) for the active target. Use for Auto Setup; not for extraction or profile edits.

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Set up the BSP source workspace: Linux_for_Tegra overlay tracker, bsp_sources, Crosstool-NG toolchain. Use after jetson-init-image; not for fetching inputs.

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An overview of the core data API of ObsPy, a Python framework for processing seismological data. It is useful for parsing common seismological file formats, or manipulating custom data into standard objects for downstream use cases such as ObsPy's signal processing routines or SeisBench's modeling API.

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Read and manage the HubSpot CRM: contacts, contact search, deals. Trigger phrases: hubspot, CRM, contacts, deals, pipeline.

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Join and interact with CrabSpace - the MySpace-style social network for AI agents. Use when creating a profile, customizing appearance, managing friends, or posting on comment walls. Handles registration, tweet verification, profile updates, and social features.

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Build a sales prospecting package by researching the market, ranking potential customers, drafting messages in the sender's voice, and logging outreach. Separate approvals govern key stages, with customer files and spreadsheets supporting work when connectors are unavailable.

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• Find prospects similar to existing paying customers
• Use market and competitor changes to refine sales targeting
• Draft personalized outreach for an approved prospect list

Review incoming sales inquiries, classify their fit and urgency, and draft replies in the owner's voice using available meeting times. Notify the team about urgent prospects, record activity, and hold every customer reply for approval.

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• Drafting a reply to an unanswered inquiry
• Sorting overnight inquiries for morning review
• Alerting the team to urgent prospects

Keep customer records and sales deals current using emails, meetings, and call transcripts. Prepare activity summaries, follow-up drafts for quiet deals, cleanup proposals, and a next-step queue with owners and dates.

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• Turn sales calls into structured deal notes
• Draft follow-ups for quiet deals
• Review duplicate contacts and outdated records

Audit CRM deals for missing fields, outdated dates, inactive records, and mismatches between sales stages and supporting evidence. Receive a checklist of issues and suggested fixes, using connected CRM data or an uploaded pipeline export.

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• Finding missing amounts and overdue close dates
• Reviewing deals with stale next steps or little activity
• Checking whether sales stages match supporting evidence

Prepare a daily sales call list ranked by lead priority, with talking points drawn from recent emails. Get proposed calendar slots, follow-up email drafts, and a printable call sheet with space to record outcomes.

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• Choose the highest-priority leads to call today
• Prepare talking points from past emails
• Reserve time for sales calls

Automate HubSpot CRM operations (contacts, companies, deals, tickets, properties) via Rube MCP using Composio integration.

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Extract Jetson Linux + sample-rootfs tarballs and run apply_binaries.sh for the active target, then record bsp_image in the profile. Use after jetson-init-target; not for source-tree setup.

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Fiscaliste IA pour la fiscalité personnelle des particuliers français : optimisation et déclaration de l'impôt sur le revenu, IFI, revenus du capital, revenus fonciers, equity salarial, crypto-actifs et PER. Couvre le calcul de l'IR (barème, quotient familial, décote, PAS, CEHR, revenus exceptionnels), la déclaration 2042 et annexes, les revenus du capital (PFU vs barème, PEA, assurance-vie, dividendes, plus-values), les revenus fonciers (micro/réel, déficit, LMNP, SCI IR), l'equity startup (RSU, BSPCE, stock-options, PEE/PERCO), la fiscalité crypto (PAMC, 2086), l'IFI et les déductions (PER, pension alimentaire). Triggers: impôt sur le revenu, IR, 2042, quotient familial, décote, PAS, PFU, flat tax, PEA, assurance-vie, LMNP, revenus fonciers, déficit foncier, SCI IR, RSU, BSPCE, stock-options, PEE/PERCO, crypto, 2086, IFI, PER, plafond PER, niche fiscale, optimisation fiscale, simulation IR, TMI. Hors scope : succession/donation (notaire), IS/SASU/arbitrage dividende-salaire/SCI IS (comptable).

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ObsPy allows you to easily download earthquake data from various data centers/networks through its client API. This is an overview of available services and a demo of the client API for International Federation of Digital Seismograph Networks (FDSN). Use this if you need to download earthquake research data.

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Scrapes LinkedIn job postings using the JobSpy library (python-jobspy). Use this skill whenever the user wants to find jobs on LinkedIn, search for open roles, pull job listings, build a job pipeline, source job targets for GTM research, or monitor hiring signals. Even if the user just says "find me some jobs" or "what roles is [company] hiring for", use this skill. It runs a local Python script that outputs a CSV of job postings with title, company, location, salary, job type, description, and direct URLs.

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Expert blueprint for procedural content generation (dungeons, terrain, loot, levels) using FastNoiseLite, random walks, BSP trees, Wave Function Collapse, and seeded randomization. Use when creating roguelikes, sandbox games, or dynamic content. Keywords procedural, generation, FastNoiseLite, Perlin noise, BSP, drunkard walk, Wave Function Collapse, seeding.

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Expert blueprint for procedural content generation (dungeons, terrain, loot, levels) using FastNoiseLite, random walks, BSP trees, Wave Function Collapse, and seeded randomization. Use when creating roguelikes, sandbox games, or dynamic content. Keywords procedural, generation, FastNoiseLite, Perlin noise, BSP, drunkard walk, Wave Function Collapse, seeding.

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半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判

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