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半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判

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Batch download academic paper full-text (PDF/XML) from a list of DOIs. Handles 25 DOI prefixes across 19 publisher families via three layered routes: (1) publisher TDM APIs requiring institutional subscription (Elsevier ScienceDirect, Wiley Online, Springer Nature), (2) Open Access sources (Crossref, Unpaywall, OpenAlex), and (3) a browser-based fallback for paywalled publishers without TDM access (ACS, RSC, IEEE, AIP, IOP, APS, Annual Reviews, T&F, Chinese journals). Browser fallback offers two routes — Route A drives the user's logged-in Chrome via the OpenClaw `browser` tool with `profile="user"` (best for interactive sessions), Route B uses the standalone `auto-paper-harvester` CLI with its built-in Playwright (best for unattended bulk runs). Use when the user wants to harvest, scrape, fetch, or bulk-download papers from a DOI list, savedrecs export, or Excel; or wants to fill missing full-text PDFs for an existing literature collection. Triggers on phrases like "批量下载文献", "下载全文", "harvest papers", "scrape full text", "TDM API", "下载 Elsevier 全文", "Wiley 批量下载", "下载 PDF".

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Generates engineering-standard drawings (P&ID, SLD, floor plans, isometric) with ISA-5.1 and IEEE symbol libraries in SVG/DXF format. Activates for drawing generation, diagram creation, blueprint packaging, and output formatting from verified engineering calculations.

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Personal research-paper radar. Fetches the latest papers and code repos for the user's keyword subscriptions across arXiv, Crossref (IEEE/ACM), Semantic Scholar, GitHub, HuggingFace, Papers with Code and RSS; deduplicates against history; then YOU (the assistant) expand the queries, filter for computer-science relevance, write Chinese summaries, detect hot sub-fields, and emit a Markdown + HTML digest (optionally emailed). Use when the user asks to "run my paper radar / 文献雷达", "check for new papers", "what's new in my topics", "今天有什么新论文 / 最新文献", "today's research digest", or to configure their keyword subscriptions / sources / schedule.

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Insert, format, and cross-reference academic citations in Word (.docx) documents. Supports GB/T 7714-2015 (Chinese), IEEE, and APA 7th.

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Inserts, formats, and cross-references academic citations in docx. Invoke when user needs to insert references, fix citation order, add cross-reference hyperlinks, or reformat bibliography to Chinese (GB/T 7714) or international (IEEE/APA) standards.

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Insert, format, and cross-reference academic citations in Word (.docx) documents. Supports GB/T 7714-2015, IEEE, APA 7th.

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Format citations across academic styles (APA 7, Chicago, Vancouver, IEEE) using CSL processors and R tooling. Convert between citation styles, generate in-text citations and reference lists, and validate formatting against style guides using citeproc, knitcitations, and Quarto's built-in citation engine. Use when rendering a Quarto or R Markdown document with formatted citations, converting a bibliography between citation styles, generating a standalone reference list, or setting up citation infrastructure for a multi-document project.

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Generate context-aware quality checklists for code review and QA using IEEE 1028 base standards plus LLM contextual additions

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Use when a task needs the judgment of an Electrical and Electronics Drafter — sizing a conductor and conduit for a panel or feeder circuit against NEC ampacity and fill tables, building a schematic/elementary diagram or one-line diagram on IEEE 315/ANSI Y32.2 symbols, cross-referencing wire numbers between a schematic and a panel wiring diagram, sizing a PCB trace against IPC-2221 current tables, or QC-checking an electrical drawing set before issuance.

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Place pre-screened literature citations into a LaTeX or Word manuscript, or restyle the citations already in one. Three modes: (1) inline placement — inline \cite{}/\citet{}/\citep{} with a compiled references.bib, for author-date journals (APA, MLA, Harvard, Chicago author-date, IEEE, Vancouver); (2) footnote placement — full formatted \footnote{} or OOXML footnotes for legal and notes styles (Bluebook, OSCOLA, Chicago, APA, McGill) with Id./supra short forms; (3) restyle — convert existing footnote citations from one style to another. This skill is manual-invoke ONLY — trigger ONLY when the user explicitly runs /cite-placement or explicitly names the "cite-placement" skill. Do NOT auto-trigger on general citation, footnote, or reference requests.

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SciPilot Skills 家族成员，负责科研数据可视化——但定位不是"画图工具"， 而是"可视化顾问"。先做数据剖析（列类型/样本量/分布/异常值/分组结构/相关性）， 再结合用户的论证目标推荐图型，主动拦截科研画图的经典错误（小样本画均值柱掩盖 分布、双 Y 轴、饼图、Y 轴不当截断、rainbow 色图、把分类点连成折线等），最后 产出 Nature / Science / IEEE / Elsevier / PNAS / 中文核心期刊级别的成图。 覆盖纯数据图：折线、柱状、散点、箱线 / 小提琴、热力图、误差棒、分布图（直方 图 / KDE）、相关性矩阵 / 散点矩阵、多面板组合。技术栈 matplotlib + seaborn + SciencePlots（静态）+ plotly（交互）。中英文双语，中文模式自动配置 Noto Sans CJK / Source Han Sans / SimHei 并修复负号方框，支持中文期刊"宋体正文 + Times New Roman 数字"混排。默认色盲安全配色 + 冗余编码 + 灰度预览。出图后做 "视觉自检闭环"：渲染 PNG 预览→程序自检缺字/文字裁切/刻度重叠→AI 读图复核遮盖 与子图对齐→回改重渲，直到通过。 当用户的任务涉及以下任何情况时主动触发：论文配图、科研画图、数据可视化、 不知道用什么图、怎么展示数据、用什么图好、期刊投稿图、figure、出版级图表、 matplotlib、seaborn、plotly、误差棒、显著性标注、色盲安全配色、矢量图导出、 中文论文图表、多面板。**即使用户只是给一批数据问"这个怎么画"或"用什么图 好"，也应使用本技能——本技能首要能力是"判断该用什么图"，其次才是绘制。** 不做示意图、流程图、架构图。

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Generate IEEE 830 SRS from raw requirements. Use when the user says "write SRS", "generate requirements doc", "analyze requirements", "I have raw requirements from a client", or pastes a client email/chat/PRD.

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Generate IEEE 830 SRS from raw requirements. Use when the user says "write SRS", "generate requirements doc", "analyze requirements", "I have raw requirements from a client", or pastes a client email/chat/PRD.

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Phase 6 of the SRS workflow. Reads approved plan files and generates a complete IEEE 830-compliant SRS — one file per section, no word limit. A full SRS may span 300+ pages across all files.

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Phase 6 of the SRS workflow. Reads approved plan files and generates a complete IEEE 830-compliant SRS — one file per section, no word limit. A full SRS may span 300+ pages across all files.

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学术论文参考文献管理与格式核对。输入是参考文献列表（混乱格式）、BibTeX/RIS 文件、DOI 列表、或正文+引用混合时使用。功能包括：统一格式（format）、格式检查（check）、生成 BibTeX（bibtex）、格式互转（convert）、DOI 验证（verify）、正文引用位置核对（inline）。覆盖期刊/会议/学位/标准/数据集/预发表/网页 7 种文献类型，GB/T 7714 与 APA/IEEE/Nature 多种风格。不适用于：正文段落润色（用 academic-writing）、图表生成（用 academic-figure）。

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Convert LaTeX papers between journal/conference templates for journal resubmission or template switching (e.g., Springer → MDPI, IEEE → Nature, IPOL → CVPR) through a privacy-preserving anonymized workflow. Use when the user provides a LaTeX .tex/project plus a target template directory or .tex file. Assume the input is not anonymized unless the user explicitly says it is already anonymized. Preserve privacy sentinels exactly; never open mapping.private.json except as a local script argument.

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Submission-grade remote-sensing Nature/high-impact journal figure workflow for Python or R. Use whenever the user asks to create, revise, audit, or polish manuscript figures, multi-panel scientific plots, map-led composites, remote-sensing image plates, sensor/product workflow figures, validation/error/uncertainty panels, or journal-ready SVG/PDF/TIFF outputs, especially for Nature-family, Remote Sensing of Environment, ISPRS, IEEE TGRS, or other high-impact venues. Before plotting, define the figure's conclusion, evidence logic, export needs, and review risks. If the user has not chosen Python or R, ask "Python or R?" and stop. Use only the selected backend for figure generation, previewing, exporting, and QA. Supports matplotlib/seaborn and ggplot2/patchwork/ComplexHeatmap. Not for dashboards or Illustrator/Figma-first infographics. Also trigger on general academic-writing figure needs even without the word "Nature", such as making figures/plots for a paper, scientific/academic plotting, data visualization for a manuscript, and Chinese phrasings like 遥感论文配图、学术写作配图、科研绘图、科研作图、地图出图、论文图表、可视化.

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Professional project management skill aligned with PMBOK® 6th/7th Edition standards. Use this skill when you need to define requirements (ISO/IEC/IEEE 29148), review project plans, generate progress reports with Earned Value Management (EVM), conduct risk analysis, estimate costs, or provide project health assessments. Ideal for creating comprehensive project documentation, analyzing project performance metrics (SPI, CPI, EAC), managing risks across 14 categories, and ensuring stakeholder alignment. Triggers: "create project plan", "analyze project health", "calculate EVM", "risk assessment", "requirements definition", "progress report", "cost estimation", or requests involving PMBOK knowledge areas.

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Signpost (not a knowledge pack) for the systems-engineering standards landscape — ISO/IEC/IEEE 15288, 24748, 29148, 42010, 15026, 24765; INCOSE SE Handbook & Vision 2035; OMG SysML; SAE/EIA 1001/649/748; ECSS space standards; NATO AAP-48; CMMI; NIST SP 800-160; and more. Contains NO source content: it lists each standard's designation, title, purpose, owning SDO, whether it's redistributable, and where to get it. Use when you need to identify or locate an SE standard — most are paywalled/all-rights-reserved and cannot be packaged, so this points you to the owner (and to the open packs where one exists).

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Knowledge base from the NIST Framework for Cyber-Physical Systems (SP 1500-201/202/203, v1.0, 2017). Use for engineering and analyzing cyber-physical systems (CPS) and IoT: the CPS Framework's aspect × facet grid (nine aspects of concern examined through conceptualization, realization, and assurance facets), cross-property trustworthiness risk management (safety/security/privacy/reliability/resilience together), data interoperability (syntactical/semantic/contextual, canonical models, identifiers, provenance), the timing aspect (time-interval classes, time domains, time-aware networking) and secure/resilient time (GNSS jamming/spoofing, PTP/NTP attacks, holdover, the clock-error model and Allan/MTIE metrics), plus the use-case requirements method. Bridges IT and OT under a clock. Scope limits: a 2017 living/draft document, thin on post-2017 standards and on detailed control catalogs; it names but does not reproduce ISO/IEC/IEEE 42010 and 15288 process text or permission-licensed third-party figures.

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Knowledge base from NIST SP 800-37 Revision 2, the Risk Management Framework (RMF) for information systems and organizations. Use for the seven RMF steps (Prepare, Categorize, Select, Implement, Assess, Authorize, Monitor) and their tasks; the three-tier organization-wide risk model; authorization boundaries; the requirements-to-controls relationship; security categorization (FIPS 199/200 high-water mark) and control selection/tailoring (SP 800-53/53B baselines); assessment, the authorization decision and risk acceptance, continuous monitoring and ongoing authorization; the security/privacy distinction; and supply chain risk management. This is the security-and-privacy-risk-governance edge of systems engineering — it governs how much protection and whether to accept residual risk, complementing the disciplines that decide how protection is built. Does NOT reproduce the SP 800-53 control catalog or its baselines, the FIPS impact tables, or the ISO/IEC/IEEE 15288 process text; it names and routes to them rather than restating them.

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Guidance on writing high-quality requirements: the requirement quality characteristics and the EARS (Easy Approach to Requirements Syntax) patterns — ubiquitous, event-driven, state-driven, optional-feature, unwanted-behaviour — for unambiguous, singular, verifiable requirements, plus defect/anti-pattern review and verification & traceability. Use when authoring or reviewing requirements. Original synthesis citing EARS (Mavin et al.) and NASA public-domain guidance; not a reproduction of ISO/IEC/IEEE 29148 or the EARS paper.

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