344 件 ・ 関連度順
概要と使いどころ
Use when turning a personal agent skill into an open-source, distributable one. Runs a PII audit, generalizes personal details, checks licence compatibility, reviews cross-platform adapters and walks through packaging.
日本語の概要は準備中です。原文の説明を表示しています。
uv workflows for Python — dependencies, virtualenvs, PEP 723 scripts, Python version management, CI, and Docker. Use when working on Python packaging/deps/tooling, writing GitHub Actions for Python projects, or building Docker images for Python apps.
日本語の概要は準備中です。原文の説明を表示しています。
Guide FunClip ASR video/audio clipping, LLM-assisted clipping providers, and release packaging workflows.
日本語の概要は準備中です。原文の説明を表示しています。
Operate AnyLabeling desktop annotation, auto-labeling model, dataset export, install, packaging, and release workflows for the PyQt6/ONNX image-labeling package.
日本語の概要は準備中です。原文の説明を表示しています。
Use when packaging Spring Boot 4 as an OCI image, JVM container, AOT application, or GraalVM native executable. Covers buildpacks, layers, runtime hints, probes, security, and verification.
日本語の概要は準備中です。原文の説明を表示しています。
Use when packaging a Spring Boot 3 application as an OCI image or GraalVM native executable. Covers buildpacks, layered images, JVM containers, AOT hints, probes, security, and verification.
日本語の概要は準備中です。原文の説明を表示しています。
Owns project and build-level work for Compose and Compose Multiplatform apps: bootstrapping a new project, adopting the kit in an existing project, adding or extracting a module, convention plugins in build-logic, the version catalog, and CI plus agent hooks. Use when starting a Compose Multiplatform app, adding a module, or editing settings.gradle.kts, build.gradle.kts, build-logic, libs.versions.toml, or packaging. Do NOT use for routing and architecture choices (compose-architecture), feature code (compose-feature), repositories and persistence (compose-data), composables or resources (compose-ui), or commonMain vs platform code (compose-platform).
日本語の概要は準備中です。原文の説明を表示しています。
Design and optimize pricing strategies for SaaS products including tiering, packaging, value metrics, and experimentation. Use when setting initial pricing, optimizing conversion, expanding revenue, or when users ask about pricing strategy, monetization, or revenue optimization.
日本語の概要は準備中です。原文の説明を表示しています。
Review an openai-guardrails-python release plan or final release candidate against the previous remote tag, determine the compatible release type, audit runtime and packaging risk, inspect current CI, and produce an English ship-or-block report. Use for pre-release readiness checks, not ordinary PR review or implementation.
日本語の概要は準備中です。原文の説明を表示しています。
Use when planning new bundle-plugins, splitting complex skills, combining skills into bundles, or exploring a vague idea about packaging skills
日本語の概要は準備中です。原文の説明を表示しています。
Use when packaging Docker deployments as 1Panel local app store apps, including GitHub projects, docker-compose.yml files, docker run commands, app metadata, version directories, icons, README files, and 1Panel validation.
日本語の概要は準備中です。原文の説明を表示しています。
Production guidance for assessing, exporting, packaging, integrating, capturing, validating, and handing off Lottie vector animations. Use for Bodymovin/Lottie JSON, dotLottie archives, renderer and player compatibility, fonts and glyphs, image assets, markers and segments, deterministic video capture, responsive sizing, optimization, accessibility, and cross-platform QA; not for general After Effects animation craft or live-action/video delivery.
日本語の概要は準備中です。原文の説明を表示しています。
Provider-independent real estate media production for listing photos, virtual staging, property videos, walkthrough reels, floor-plan explainers, neighborhood clips, renovation concepts, agent ads, and generated or retouched property visuals. Use when creating, editing, reviewing, prompting, packaging, or approving real estate marketing content where property truthfulness, listing/MLS compliance, fair-housing risk, staging disclosure, privacy, accessibility, platform variants, or real-estate QA matter.
日本語の概要は準備中です。原文の説明を表示しています。
Provider-independent ecommerce product imagery production for marketplace listings, product pages, hero shots, lifestyle scenes, comparison charts, infographics, variant/packaging images, virtual try-on or placement mockups, ads, and AI-assisted product visuals. Use when an agent must plan, generate, edit, review, localize, package, or QA truthful commercial product images while managing SKU continuity, marketplace requirements, claims, rights, releases, accessibility, and approval.
日本語の概要は準備中です。原文の説明を表示しています。
Provider-independent production guidance for AI agents creating or retouching appetizing food and beverage images, recipe videos, restaurant/menu visuals, CPG ads, ecommerce product images, beverage pours, packaging/lifestyle shots, and social food clips, including truthfulness, labeling/claims discipline, styling, prompt translation, platform variants, accessibility, rights, alcohol, and QA.
日本語の概要は準備中です。原文の説明を表示しています。
Workflow for packaging analysis outputs into reproducible reports, clean tables, and publication-ready figure exports.
日本語の概要は準備中です。原文の説明を表示しています。
Create, edit, evaluate, and package agent skills. Use when building a new skill from scratch, improving an existing skill, fixing a skill that never triggers or fires unreliably, running evals to test a skill, benchmarking skill performance, optimizing a skill's description, reviewing third-party skills for quality, or packaging skills for distribution — even if the user doesn't explicitly say "skill" (e.g. "teach Claude to do X", "make the agent always follow Y"). Not for using skills or general coding tasks.
日本語の概要は準備中です。原文の説明を表示しています。
AI Pricing Skill workflow skill. Use this skill when the user needs When the user wants to price an AI product, choose a charge metric, design pricing tiers, or optimize margins. Also use when the user mentions 'AI pricing,' 'usage-based pricing,' 'consumption pricing,' 'outcome pricing,' 'BYOK,' 'bring your own key,' 'per-seat pricing,' 'pricing tiers,' 'AI margins,' 'cost per token,' or 'pricing model.' This skill covers pricing strategy, packaging, and margin management for AI-native products. Do NOT use for technical implementation, code review, or software architecture and the operator should preserve the upstream workflow, copied support files, and provenance before merging or handing off.
日本語の概要は準備中です。原文の説明を表示しています。
Create or update AgentSkills. Use when designing, structuring, or packaging skills with scripts, references, and assets.
日本語の概要は準備中です。原文の説明を表示しています。
半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判
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REQUIRED for all skill development. Automatically version control every skill file modification for rollback/comparison. Use after init_skill.sh, after every str_replace/create_file, and before packaging.
日本語の概要は準備中です。原文の説明を表示しています。
Sentence-level and section-level craft for instructions Claude will actually follow, in any container — project instructions, a standalone prompt, or skill body text. Use when the text exists or is being drafted and the question is quality: "why is Claude ignoring this instruction", "rewrite this prompt so it works", "improve my project instructions", "make this instruction stick", "is this too prescriptive", "how much structure does Sonnet need versus Opus". Covers imperative construction, positive framing, strategic-versus-procedural calibration per model, extended thinking, complexity scaling, and a quality checklist. For deciding WHICH container the instruction belongs in, use crafting-instructions. For building, testing and packaging a whole skill directory, use creating-skill.
日本語の概要は準備中です。原文の説明を表示しています。
Creates production-ready MCP servers using FastMCP v2. Use when building MCP servers, optimizing tool descriptions for context efficiency, implementing progressive disclosure for multiple capabilities, or packaging servers for distribution.
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Chooses the right FORMAT for instructions on Claude.ai — project instructions, a skill, or a standalone prompt — and gives the format-specific structure once chosen. Use when the question is which container an instruction belongs in ("should this be a skill or project instructions", "where do I put this", "how do I set up this project", "is this worth a skill"), or when someone has instructions and does not know how to package them. For the writing principles that apply inside any of the three formats, use writing-instructions. For building, testing and packaging a complete skill directory, use creating-skill.
日本語の概要は準備中です。原文の説明を表示しています。