pandasで扱う表データ処理をcuDFでGPUへ移す作業を支援します。結合・集計・CSVやParquet入出力から、結果の照合、メモリ対策、複数GPU利用まで扱います。
- 既存pandas処理を少ない変更で加速
- 結合や集計をGPUへ移したいとき
- 欠損値や並び順をpandasと照合
基板の3Dデータから、正常画像や部品の位置・はんだの欠陥画像を作る処理を組み立てます。検証済みのジョブと実行側に渡す設定を作成するスキルです。
Component-owned guidance for CDF Simulation requests submitted directly or through Airflow-triggered DIG Flow Catalog prompts — golden THT board, THT pin-geometry variation, good/clean SMT images, structural pose defects, and solder texture defects, from a board USD. Turns one matched prompt into one validated `cdf.CDFJob` build and its compiled JobOrder payload; it never executes a render itself. Requires a caller-supplied board USD and output root, asks for either when missing from an interactive request, and resolves optional details with fixed, documented defaults.
基板の3Dシーンを表すUSDファイルから、検査用画像を生成するジョブを組み立てます。正常な基板、挿入実装部品のピン形状の変化、表面実装部品の位置や姿勢の欠陥、はんだの欠陥を扱います。依頼を対応する処理に当てはめ、cdf.CDFJobと、実行側へ渡すコンパイル済みのJobOrderを作成・検証します。適用した既定値も報告します。
基板の自動光学検査向けに、正常品や欠陥の合成画像を作る準備をしたいときに向いています。基板を格子状に撮影する計画や、指定部品・ピンを中心に切り出す画像の設定にも使えます。
基板USDと出力先の指定が必須です。ジョブ構築にはcdfとpcb_aoiを使います。このスキル自体はレンダリングせず、Airflowなど別の実行側が処理します。ピン形状の変更には対応する基板メタデータが必要です。はんだ欠陥のbridgeは未対応です。ライセンスはApache-2.0です。
この紹介文は、公開されている SKILL.md をもとに AI(OpenAI Codex)が作成しました。正確な仕様は下の原文を確認してください。
インストールする前に、エージェントに与えられる指示の中身を確認できます。
Turns DIG Flow Catalog prompt templates and equivalent direct requests into
cdf jobs through the declarative Python API. This skill is the
component-owned guidance for cdf-simulation: a caller supplies a board
USD and output root, this skill builds and compiles the job, and the caller
can pass the payload to its own executor. Airflow may inject those required
inputs, or the caller may provide them directly. If either is missing and
interaction is possible, ask once. All optional ambiguity is resolved with
fixed, documented defaults. If a request truly cannot be served (an
unsupported defect type, a non-USD input), say so rather than guessing at a
fake capability or silently doing nothing.
This skill does not execute. It produces a validated CDFJob build and
its compiled JobOrder payload, then stops. An Airflow DAG or another executor
chosen by the caller performs rendering.
This skill implements five DIG Flow Catalog rows, all taking a board USD as input:
| # | Row | Status |
|---|---|---|
| 1 | Golden board (THT) | Implemented |
| 2 | Variation type (THT pin geometry) | Implemented |
| 3 | Good images (SMT) | Implemented |
| 4 | Structural defects (SMT) | Implemented |
| 5 | Texture defects (SMT solder) | Implemented, except bridge (unsupported — see below) |
Beside the catalog rows, the skill serves the five reference flows in
references/reference-flows.md: complete
inspection jobs, each phrased as one prompt whose compiled plan must equal
the equivalent YAML config. A prompt carrying a flow marker -- a scan grid
and "stitched", a defect on a named refdes ("shift on C33",
"insufficient solder on J17", "missing-component defect on LS1"),
"component-focus" or "pin-focus" crops -- is a flow, not a catalog row, and
takes its fixed values from that file (they differ from the catalog
defaults: shift is translate_range=0.5, rotate_z_range=5.0 with no
variant_index, crops are ROI captures rather than postprocess.crop).
| Flow | Prompt marker |
|---|---|
| G golden scan | "golden board dataset ... NxM scan ... stitched" (single board or panel) |
| C component defects | "shift/tombstone/sideflip/reverse polarity on <refdes>" + "component-focus crops" |
| S SMT solder defects | "insufficient/excess/interrupted/missing solder on <refdes>" + "component-focus crops" |
| M missing component | "missing-component defect on <refdes>" |
| T THT solder defects | six THT solder defects on refdes + "pin-focus crops from the bottom" (single board or panel) |
Every unspecified optional detail resolves to a documented default rather
than a question. The full table -- board identity and paths, the rule that a
named component must resolve on the attachment, THT board requirements,
pin-variation magnitude ranges, the required structural-defect magnitudes
(translate_range, rotate_z_range, angle_range -- the API has no
defaults for these and a catalog prompt never states them), the coverage
ratio, how multiple defect types combine, and the solder texture-defect
mapping -- is in
references/fixed-defaults.md.
Read it before building any script. The values are not obvious and
several of them are load-bearing: the coverage ratio applies to structural
and solder defects, and the crop class_filter taxonomy is not the same as
component_types.
What this skill returns to its caller, what it accepts, and how each value is
validated is in
references/payload-contract.md. The short
version: the output is a CDFJob build plus the compiled JobOrderPlan from
job.compile_orders(...), serialized with JobOrderCodec.dumps(plan) (a
bare plan.model_dump() is not JSON-serializable), together with a
resolved-inputs summary naming every default that applied. The caller supplies
the board USD and output root -- both required, with no fallback. This
skill supplies everything else from the catalog row and fixed defaults, and
marks each variant for an independent process.
Four steps, in order. Step 1 decides everything downstream, so do not start writing a script before the row is settled.
references/reference-flows.md, "Routing"):
a named refdes target, a scan grid with "stitched", "component-focus" /
"pin-focus" crops. With a marker present the prompt is that flow; without
one it is a catalog row. A prompt matching no row and no flow
explains the supported request shapes and asks the caller to choose one;
it never assembles a best-effort substitute out of the pieces that do
exist.references/fixed-defaults.md.cdf.CDFJob script, following the row's shape in
Workflow. One job per variant: the executing side must launch
each variant as its own process, because sequential
job.capture.render(...) calls in one process crash the second Kit
subprocess -- so the payload says one variant, never a loop.job.compile_orders(...), read the result, and return the build plus the
compiled plan to the caller. Do not call render() here. Report what was
assumed alongside the payload.Each value is resolved from the first source that supplies it:
state file -> explicit prompt arguments -> agent context -> user prompt text
| Input | Required | Where it comes from if unset |
|---|---|---|
| Catalog row | yes | Matched from the prompt shape; no default. No match asks the caller to choose a supported shape |
| Board USD (attachment path) | yes, caller-provided | No fallback. Ask for a missing path when interaction is possible; for non-interactive automation, stop with refusal case 3. Never substitute a sample board |
| Output root | yes, caller-provided | No fallback. Ask for a missing path when interaction is possible; for non-interactive automation, stop with refusal case 3. Never synthesize a directory |
| Component sidecar | optional legacy input | Prefer embedded USD metadata with source="usd". Attach a matching <stem>.components.json only when a legacy standalone board relies on it or the caller explicitly selects that source; file presence alone does not select it. Instanced panels require embedded metadata |
Board root_path | no | Read from the supplied stage, or from the selected legacy sidecar for a sidecar-backed board. For instanced panels follow references/reference-flows.md, "Panels". Opening the attachment is required; an unreadable or unresolved board stops with refusal case 3. Never use another board's root as a fallback |
| Named component | from the prompt | Passed through as named when present in the selected metadata source (embedded USD by default, or an explicitly selected legacy sidecar -- list types, do not guess); a missing name is refusal case 4, never substituted. State the check in the run summary |
| Component types | no | The row's documented set |
| Seed, scan grid, board side, resolution, pin numbers (flows) | no | Explicit prompt arguments in the forms listed in references/reference-flows.md ("Seed 7", "a 5x4 scan", "of the bottom side", "at 2000x2000", "(pin SH)"); otherwise that file's per-flow defaults |
| Panel instances | from the attachment | When the attachment composes one board as several USD instances (<root>/StepRepeats/SR_*), register all of them with job.scene.instances(...); image budgets multiply by the instance count (references/reference-flows.md, "Panels") |
| Coverage ratio | no | The single documented ratio, applied to structural and solder defects; the executing side selects max(1, int(pool * ratio)), so a non-empty selection always yields at least one defect |
| Defect magnitudes | no | The per-type ranges in references/fixed-defaults.md |
class_filter | no | None. Never a component-type string -- different taxonomy |
State what was resolved and from where in the run summary so the caller can see which defaults applied.
Use the sample-prompt phrasing in the table under "Catalog coverage" and in "Examples" below to classify the request into exactly one of rows 1-5.
If a prompt does not clearly match any of the rows or a reference flow, explain the supported request shapes and ask the caller to choose one.
Extract from the prompt: attached USD path, output root, named component(s), variation/defect type, "full board coverage" flag. Then open the attachment and read two things from it: the board root and its component types, using embedded metadata by default or the selected legacy sidecar for a sidecar-backed standalone board. A named component that appears in those types is used as named; a name that is absent is refusal case 4 -- never a substitution. Apply the fixed defaults above for optional details the prompt does not specify, and record both reads (root source, component check) in the run summary.
The attachment path and the output root are the two inputs with no
default. If either is absent and interaction is possible, ask for it once.
For non-interactive automation, stop and report it (refusal case 3).
Never substitute a sample board or invent an output directory. Prefer embedded
USD metadata. Attach a component sidecar only when a legacy standalone board
relies on it or the caller explicitly selects it; do not switch sources merely
because a .components.json file is nearby. Keep all metadata-dependent calls
on that source. Instanced panels cannot use legacy component sidecars.
CDFJob scriptimport pcb_aoi before constructing the job. The "pcb-aoi" domain
registers on import; without that import CDFJob(domain="pcb-aoi", ...)
raises unknown domain 'pcb-aoi' (registered: none) on the very first line.
Every template below assumes import pcb_aoi and from cdf import CDFJob
at the top of the script.
Every row requires job.capture.renderer(mode="pathtracing", resolution=..., spp=..., total_spp=..., max_bounces=...) before capture.camera/scan_grid/outputs -- it is a required field, compile_orders() rejects a plan missing it ("capture render pass 'default' is missing: renderer"). Every template below assumes this call is present even where not shown explicitly.
capture.camera(rotation_range=...) is required, not optional -- only
side= has a default. A top-side capture with no rotation asked for still
needs rotation_range={"z": 0}; omitting the kwarg is a TypeError before
anything is compiled.
Several operations.add_* calls have required magnitude kwargs with no
defaults (add_shift needs translate_range and rotate_z_range;
add_tombstone and add_sideflip each need angle_range). A catalog prompt
never states them, so they come from the fixed table in
references/fixed-defaults.md -- do not invent
a number and do not ask.
Declaration order matters and is enforced. job.scene.select_components(...)
must be declared before job.annotations.label_components(...) --
compile_orders() rejects the reverse order with
annotations.components.apply requires component selection to be declared first. Every template below follows select → (operations) → annotate.
scene.select_components(source=..., types=None) without types= needs
either USD-embedded component metadata or source="components" pointing at
an attached sidecar -- bare source="usd" with no types and no sidecar
fails at runtime with component selection needs explicit types or board metadata. Prefer confirmed embedded USD metadata. For a legacy standalone
board that requires a sidecar, attach its matching file with
job.scene.attach_sidecar(name="components", kind="pcb.components", path=...)
and use source="components" consistently. Do not mix that source with
embedded metadata or attach a sidecar solely because the file exists.
Generate a standalone script with imports, build_job() -> CDFJob, an
argparse CLI accepting --usd-path and --output-dir, and main(), using
the per-row template below -- or, for a reference flow, the flow's template
and shared conventions
in references/reference-flows.md (explicit source="usd", output_start(0),
limits(...), realtime_subframes=1, the three-key camera rotation), which
are the spellings the YAML interpreter produces. Place generated PCB scripts under pcb_aoi/examples/ only if the run is
meant to be durable/reusable; for a one-off request, build and compile the
job in-memory, then emit the payload
(references/payload-contract.md)
without necessarily writing a file to disk. Execution belongs to the caller's
chosen executor, never this skill.
Row 1 — Golden board (THT): the template uses embedded USD metadata. For
a legacy sidecar-backed standalone board, attach its matching component
sidecar and use its job-local source name consistently instead of "usd".
job = CDFJob(domain="pcb-aoi", random_seed=0)
job.scene.configure(usd_path=..., root_path=...) # root confirmed on the supplied stage
job.scene.select_components(types=[<the attachment's component family>], source="usd")
job.appearance.lighting(mode="white_light", exposure_range=(0.0, 0.0),
cone_angle_range=(120.0, 120.0), cone_softness_range=(1.0, 1.0),
dome={"intensity": (1000.0, 1000.0), "visible": True})
# The catalog's golden board carries PROCEDURAL solder: joints are generated,
# no defect is applied. `procedural` is valid here precisely because no
# add_* solder-defect call follows (those require surface_evolver).
job.operations.solder_joints(solver="procedural", component_types=[<the same family>], source="usd") # component_types names the family the joints are generated for. With a sidecar attached, this reads source="components" too -- all three source= arguments in a row must name the same metadata source
job.annotations.label_components(source="usd") # likewise source="components" when the sidecar is attached
job.capture.renderer(mode="pathtracing", resolution=(1920, 1080), spp=1, total_spp=32, max_bounces=4)
job.capture.camera(side="bottom", rotation_range={"z": -90})
job.capture.scan_grid(x_count=1, y_count=1)
job.capture.outputs(rgb=True, bounding_box_2d_tight=True,
semantic_segmentation=True, colorize_semantic_segmentation=True)
# No postprocess.crop() call -- this row has no crop.
camera_path/camera_xform_path/ring_light_root are optional
(scene.configure's default is None) -- omit them rather than assuming
the /World/camera_light/... Allegro rig exists verbatim on every board;
the pipeline falls back to a synthesized camera when unset.
Row 2 — Variation type (THT pin geometry):
job = CDFJob(domain="pcb-aoi", random_seed=0)
job.scene.configure(usd_path=..., root_path=...) # a board that authors pcba:mesh:role -- see below
job.appearance.lighting(mode="white_light", exposure_range=(0.0, 0.0),
cone_angle_range=(120.0, 120.0), cone_softness_range=(1.0, 1.0),
dome={"intensity": (1000.0, 1000.0), "visible": True})
job.operations.pin_variation(components=[<THT refdes>], offset_range=(0.1, 0.4)) # or tilt_range/cut_angle/height_variation
job.capture.renderer(mode="pathtracing", resolution=(1920, 1080), spp=1, total_spp=32, max_bounces=4)
job.capture.camera(side="bottom", rotation_range={"z": -90})
job.capture.scan_grid(x_count=1, y_count=1)
job.capture.outputs(rgb=True)
Row 2 needs a board whose through-hole leads are authored with the
pcba:mesh:role schema (pkg_lead meshes); a THT board without it cannot
run pin_variation at all (see "THT board requirements" in
references/fixed-defaults.md). pin_variation(...) targets leads directly
by components=/package_types= -- it does not need
scene.select_components(...) or annotations.label_components(...)
declared first (unlike every other row). Selector: the refdes the prompt
names, confirmed on the attachment; with no part named, see the selector
rule in references/fixed-defaults.md.
Row 3 — Good images (SMT): board-level ("20 good PCB images") uses
capture.scan_grid(x_count=X, y_count=Y) where X * Y is the requested
count, not N in each axis -- scan_grid(x_count=20, y_count=20) is 400
renders, not 20. Pick the most square factorisation at or just above the ask
(20 -> 5x4; 30 -> 6x5; a prime like 17 -> 5x4 = 20 and say so), no
crop, select_components(types=[<every component family the attachment carries>], source="usd") -- the families are read from the attachment
(pcba:component:footprintId), so on a one-family board the list has one
entry (e.g. types: [C_0805_2012Metric]); a bare
select_components(source="usd") with no types= compiles to a different
plan (types: null). Component-level ("good images of <component>, max 3") narrows first with
select_components(types=[<component_type>], source="usd"), then
after the same capture block adds
job.postprocess.crop(method="bbox_tight", types=["rgb", "semantic_segmentation", "component_instance"], class_filter=None, offset=10, xform_depth=7, output_subdir="cropped")
and caps capture.limits(max_images=3) (or the requested max). class_filter=None, never the component-type string -- see "Pitfall: class_filter is not component_types" below: class_filter=["PASSIVE_SMD_0805"] compiles and executes with "error": "" but silently produces zero crop files, because annotations.label_components assigns the semantic class "capacitor" to that component, not the literal type string. No solder or structural-defect operations for this row -- clean/golden only; output stops at the rendered/cropped RGB.
Board-level Row 3, complete (only the grid and the render size come from the prompt):
job = CDFJob(domain="pcb-aoi", random_seed=0)
job.scene.configure(usd_path=..., root_path="/Board") # the attachment's default prim
job.scene.select_components(types=[<all families of the attachment>], source="usd")
job.appearance.lighting(mode="white_light", exposure_range=(0.0, 0.0),
cone_angle_range=(120.0, 120.0), cone_softness_range=(1.0, 1.0),
dome={"intensity": (1000.0, 1000.0), "visible": True})
job.annotations.label_components(source="usd") # always: the good images ship their labels
job.capture.renderer(mode="pathtracing", resolution=(1920, 1080), spp=1, total_spp=32, max_bounces=4)
job.capture.camera(side="top", rotation_range={"z": 0})
job.capture.scan_grid(x_count=X, y_count=Y) # X * Y = the requested count
job.capture.outputs(rgb=True, bounding_box_2d_tight=True,
semantic_segmentation=True, colorize_semantic_segmentation=True)
# no operations, no postprocess.crop
Row 4 — Structural defects (SMT): the same SMT scene as Row 3, with pose
operations declared after select_components and before
label_components, then operation labels and the per-component defect
crop. Rows 4 and 5 always emit per-component defect crops -- this is
the one output contract for both rows (references/class-filter-taxonomy.md):
annotations.enable_operation_labels(namespace="defect") puts the defect
class in the segmentation output, and the same postprocess.crop(...) block
as Row 3's component-level case follows the capture. A record with no file
under cropped/ is a failed record, not a board-level variant. The
narrowed select_components(types=[...]) is the scope of every pose
operation; whether add_tombstone also takes component_types= depends on
the attachment's metadata source -- see "Scoping by metadata source" below.
This legacy standalone-board example uses a component sidecar (the CAD_BOARD board used by
pcb_aoi/examples/allegro_defect_job.py); on an embedded-metadata board
use source="usd" throughout and the tombstone scoping below.
job = CDFJob(domain="pcb-aoi", random_seed=0)
job.scene.configure(usd_path=..., root_path="/Board_CAD_BOARD")
job.scene.attach_sidecar(name="components", kind="pcb.components", path=...) # sidecar board
job.scene.select_components(types=["PASSIVE_SMD_0805"], source="components") # the scope of every pose op
job.appearance.lighting(...) # same block as Row 1
job.operations.add_tombstone(ratio=0.2, angle_range=(70.0, 90.0))
# job.operations.add_shift(ratio=0.2, translate_range=0.2, rotate_z_range=15.0)
# job.operations.add_sideflip(ratio=0.2, angle_range=(70.0, 90.0))
job.annotations.label_components(source="components")
job.annotations.enable_operation_labels(namespace="defect")
job.capture.renderer(mode="pathtracing", resolution=(1920, 1080), spp=1, total_spp=32, max_bounces=4)
job.capture.camera(side="top", rotation_range={"z": 0})
job.capture.scan_grid(x_count=1, y_count=1)
job.capture.outputs(rgb=True, bounding_box_2d_tight=True,
semantic_segmentation=True, colorize_semantic_segmentation=True)
job.postprocess.crop(method="bbox_tight", types=["rgb", "semantic_segmentation", "component_instance"],
class_filter=None, offset=10, xform_depth=7, output_subdir="cropped")
One defect type per script when the prompt wants one image set per type (see
"Tell the executing side: one render() per process" below); all three in one
script only when the prompt wants a board carrying all three at once.
Scoping by metadata source. add_shift and add_sideflip have no
component_types= kwarg, so the narrowed select_components(types=[...])
is always their scope. add_tombstone does have one, and whether to use it
is decided by where the attachment's component metadata lives:
pcba:* schema, no sidecar -- every pcb-builder
export): narrow with select_components(types=[...], source="usd"), pass
eligibility_source="usd", and omit component_types. Supplying it
applies the operation to nothing: the list resolves to prim paths the
stage does not carry and the run fails with tombstone selected from 1 components but applied none of them.<stem>.components.json attached):
component_types=[...] on add_tombstone works there and may accompany
the narrowed selection. It is never a substitute for narrowing the
selection, and it is never carried over to an embedded-metadata board.Row 5 — Texture defects (SMT solder): as Row 4 -- same operation labels,
same outputs, same per-component defect crop -- but
operations.solder_joints(...) is declared once before any add_* solder
call, and the solver must actually be available in the executing environment.
The solder add_* calls take ratio only (no count) and their
component_types= works on both metadata sources.
The following is a legacy sidecar-backed standalone-board example. Prefer
source="usd" for embedded-metadata boards and omit attach_sidecar(...).
job = CDFJob(domain="pcb-aoi", random_seed=0)
job.scene.configure(usd_path=..., root_path="/Board_CAD_BOARD")
job.scene.attach_sidecar(name="components", kind="pcb.components", path=...) # sidecar board
job.scene.select_components(types=["PASSIVE_SMD_0805"], source="components") # embedded-metadata board: types=[<family>], source="usd"
job.appearance.lighting(...) # same block as Row 1
job.operations.solder_joints(solver="surface_evolver", component_types=["PASSIVE_SMD_0805"], source="components") # component_types = the selected family
job.operations.add_excess(ratio=0.2, component_types=["PASSIVE_SMD_0805"])
# chain further supported types here, e.g.
# job.operations.add_missing_solder(ratio=0.2, component_types=["PASSIVE_SMD_0805"])
job.annotations.label_components(source="components")
job.annotations.enable_operation_labels(namespace="defect")
job.capture.renderer(mode="pathtracing", resolution=(1920, 1080), spp=1, total_spp=32, max_bounces=4)
job.capture.camera(side="top", rotation_range={"z": 0})
job.capture.scan_grid(x_count=1, y_count=1)
job.capture.outputs(rgb=True, bounding_box_2d_tight=True,
semantic_segmentation=True, colorize_semantic_segmentation=True)
job.postprocess.crop(method="bbox_tight", types=["rgb", "semantic_segmentation", "component_instance"],
class_filter=None, offset=10, xform_depth=7, output_subdir="cropped")
solder_joints(solver="surface_evolver") resolves the solver inside that
call: with manifold3d or the native evolver binary missing it raises
there, before compile_orders() is reached. See
references/fixed-defaults.md — a Row 5 script
cannot even be dry-run validated in an environment that lacks them.
class_filter is not component_typespostprocess.crop(class_filter=...) takes a derived semantic class, not a
component-type string. Given the latter it compiles, reports "error": "",
and writes zero files. Default to class_filter=None and filter with
types=. Worked example and the two taxonomies side by side:
references/class-filter-taxonomy.md.
Run job.compile_orders(output_dir=...)
to catch a malformed script before anyone spends Isaac boot time. A clean
compile is where this skill's job ends: return the CDFJob build, the
compiled JobOrderPlan, and the resolved-inputs summary to the
caller, in the shape
references/payload-contract.md defines.
Do not call job.capture.render(...) from here -- this guidance is
read, not run, and execution belongs to the caller's chosen executor. Report
what was returned; do not claim images were generated, because at this point
none have been.
Tell the executing side: one render() per process. Running several
variants (for example shift, tombstone and sideflip) sequentially in one
Python script crashes the second render(): the Kit subprocess segfaults
mid-run (carb.crashreporter-breakpad fatal trace), while each variant as
its own process runs cleanly. This matches documented Isaac/replicator
fragility around rebuilding the render graph mid-session. So when a prompt
implies several output variants ("generate shift, tombstone, and sideflip
defects"), emit one payload per variant and mark them as independent
launches -- never a loop of render() calls inside one script.
| Prompt | Row | Key resolved values |
|---|---|---|
| "Generate a golden board image using the attached USD" | 1 | bottom camera, solder_joints(solver="procedural") with no defect calls, rgb+bbox+semantic, no crop |
| "Using the attached USD, generate images with tilt variation of J13" | 2 | tilt_range=(5.0, 15.0), components=["J13"] |
| "Using the attached USD, generate images with cut variation of J13" | 2 | cut_angle=(5.0, 15.0) |
| "Generate 20 good PCB images using the attached USD" | 3 | board-level, scan_grid(x_count=5, y_count=4) = 20 images, no crop |
| "Generate good images of PASSIVE_SMD_0805, max 3" | 3 | select_components(types=["PASSIVE_SMD_0805"]), component-level crop, max_images=3 (a component the attachment does not have is refused, case 4 -- never substituted) |
| "Using the attached USD, generate tombstone structural defects" | 4 | add_tombstone(ratio=0.2, angle_range=(70.0, 90.0)) (no coverage phrase → default ratio, which still yields at least one defect on a non-empty selection; angle_range is required and comes from the fixed table); enable_operation_labels + per-component crop as on every row 4/5 record |
| "Generate shift structural defects for PASSIVE_SMD_0805, with full board coverage" | 4 | select_components(types=["PASSIVE_SMD_0805"]) then add_shift(ratio=1.0, translate_range=0.2, rotate_z_range=15.0); labels + crop |
| "Using the attached USD, generate excess solder on the passives" | 5 | solder_joints(solver="surface_evolver") + add_excess(ratio=0.2, component_types=["PASSIVE_SMD_0805"]); labels + crop |
| "Generate excess solder and missing solder defects for PASSIVE_SMD_0805" | 5 | one solder_joints(...) declaration, then add_excess(ratio=0.2, ...) and add_missing_solder(ratio=0.2, ...) chained (see "Combining multiple supported defect types") |
| "Using the attached USD, generate bridge defects on the ICs" | 5 | Fail loudly — bridge unsupported |
Four cases follow. Each states plainly what was not done and why, produces no substitute, and — where part of the request is servable — still delivers that part.
1. bridge mixed with supported solder defects. Partial fulfilment, not
refusal: generate exactly the supported types named, drop the bridge clause,
report it.
Requested: bridge and excess solder. Generated: excess solder only (
add_excess(ratio=0.2, component_types=["PASSIVE_SMD_0805"]), 1 variant, output at<dir>). Not generated: bridge — solder shorting between adjacent pads/leads has no method in the currentcdfAPI. Available texture defects: insufficient, excess, bright, interrupted, missing_solder, dry_contact. I did not add any of those to make up the count, and did not approximate a bridge from the ones that exist.
2. A board whose real metadata is being overridden by the defaults. The
CAD_BOARD values belong to the CAD_BOARD example board only.
Not run. The attached USD carries its own metadata (a
<name>.components.jsonsidecar, or embeddedpcba:*metadata whose default prim is the board root) naming a different board root, so applying theCAD_BOARDvalues would silently render the wrong board identity — a mismatch that does not show up in the image. Re-run with that board's ownroot_path, or confirm the values are genuinely intended for it.
3. No board USD, or no output root. Both are required caller inputs. An attachment that is not a USD stage (for example a photograph) counts as no board USD. Ask the caller to provide the missing value when interaction is possible. In non-interactive automation, stop; do not substitute a sample board for the attachment or synthesize a directory for the output root.
Not built. This request carries no board USD (or: no output root). Both are required caller inputs and have no defaults; images are not accepted as the board input. Provide a USD attachment path and the output root.
4. A named component the attachment does not have. A validation failure, not a substitution. Check component types and refdes in the selected metadata source (embedded USD by default, or the selected legacy sidecar); if the named one is not there, build nothing.
Not built. The prompt names
<name>, which the attached board does not have (checked: <sidecar types | embedded component types>:<list>). Rendering another component in its place would deliver a dataset for the wrong part. Re-run naming one of the listed components, or attach the board that carries<name>.
What none of these do: assemble a lookalike out of the capabilities that do exist, or report success for a run that did not happen. This skill returns a payload and never renders, so it never has grounds to say images were generated -- that report comes back from the executor, or not at all.
pcb_aoi/sections.py,
pcb_aoi/examples/*.py, cdf/API_SPEC.md). If something needed does not
exist (for example bridge defects), say so plainly.C_0805_2012Metric, R_0603_1608Metric, SOT-723) look unfamiliar and
are real, and a name the attachment does not have is refusal case 4.max(1, int(pool * ratio))), and a clean board on a defect request is a
failed record.JobOrderPlan to the caller. A render() call here is a bug, not a
shortcut.postprocess.crop(class_filter=...)
— it is a different taxonomy than component_types/types= and will
silently produce zero crop files with no error. Default to
class_filter=None.bridge solder defects are unsupported; the other texture defects in
row 5 are.job.capture.render(...) calls in a single Python process segfault the
second Kit subprocess, so each payload this skill emits is one variant and
is marked as an independent launch.CAD_BOARD values.| Error | Cause | Solution |
|---|---|---|
"error": "" but zero crop files | A component-type string was passed to postprocess.crop(class_filter=...), which is a different taxonomy from component_types | Use class_filter=None; filter by types= instead |
| Second render segfaults (reported back by the executor) | Two job.capture.render(...) calls in one Python process | Emit one payload per variant, each marked as an independent launch; never a render() loop |
| This skill was asked to render | A caller treated component guidance as an executor | Compile and return the JobOrderPlan; execution belongs to the caller's chosen executor |
select_components returns nothing | The sidecar and the board USD disagree, or the source is wrong for that board | Confirm the sidecar belongs to that board; check source= against the row |
| A defect request rendered a clean board with exit 0 | The selection was empty (types= matched nothing on that attachment); a non-empty selection always yields at least one defect | Check types= against the attachment's own metadata; do not hand off a plan whose selection is empty |
Row 4/5 record with no file under cropped/ | enable_operation_labels(...) or postprocess.crop(...) was left off the record, or class_filter carried a component-type string | Both calls are part of the Row 4/5 contract; class_filter=None |
| Compile error naming an unknown operation | An API method was invented rather than confirmed | Check pcb_aoi/sections.py and cdf/API_SPEC.md; if it is absent, the capability does not exist |
| Prompt matches nothing in the catalog | A request shape this skill does not cover | Explain the supported shapes; do not substitute |
pin_variation found no through-hole leads | The board does not author pcba:mesh:role lead meshes | Report that the board's THT metadata is insufficient for pin-geometry variation; do not retry with invented parameters |
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