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Investigate malicious code placed inside legitimate Windows processes using memory analysis, event logs, and API monitoring. Identify injection methods, examine extracted code, and produce evidence reports and detection rules for suspicious process behavior.
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Investigate process hollowing, where malicious code replaces a legitimate process in memory. Compare memory with disk files, examine process relationships, and correlate network activity to document suspicious processes and guide containment.
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Analyze Sysmon logs to investigate process injection, where malicious code hides inside legitimate processes. Correlate remote thread creation, cross-process access, and unusual DLL loading, then organize findings by injection type, risk level, and ATT&CK technique.
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Programmatically driving Salesforce Approval Processes from Apex — `Approval.process(ProcessSubmitRequest)` to submit, `ProcessWorkitemRequest` to approve / reject / reassign, recall semantics, querying `ProcessInstance` and `ProcessInstanceWorkitem` to find pending approvals, and the bulk-submit / bulk-action error-row handling. Covers when to use Apex-driven approval (system-initiated submission, batch approvals, custom UIs) vs leaving the platform's standard buttons in place. NOT for the Approval Process metadata definition itself (that's admin / declarative — see admin/approval-processes), NOT for Flow-based approvals (use flow/flow-orchestration-patterns).
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Call Yao processes to query data models or run scripts. Check which operations are permitted, inspect their required arguments through the documentation workflow, and execute a process using its full name.
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Look up callable processes in Yao, inspect their arguments and return types, and check whether a process name is valid. Use the documentation to prepare calls and find suggested alternatives for misspelled names.
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Creates GDPR Article 30(2) Records of Processing Activities for data processors with all four mandatory fields: processor and controller names and contact details, categories of processing, third country transfers, and security measures description. Activate for processor RoPA, Art. 30(2), processor records, sub-processor documentation.
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Map repeatable business processes by owner and analyze time spent working, waiting, or reworking. Using stage-level timing data, produce a process diagram, ranked bottlenecks, and cycle-time measures to focus improvements on the main constraint.
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Review personal data handling against GDPR requirements, covering processing records, legal grounds, individual rights, breach procedures, and international transfers. Produce findings by article and a prioritized improvement roadmap with responsibilities, estimated costs, and timelines.
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Conducts Privacy Impact Assessment for vendor and third-party data processing arrangements. Covers processor due diligence, Data Processing Agreement (DPA) requirements under GDPR Article 28, sub-processor management, cross-border vendor transfers, cloud service provider assessments, and ongoing vendor monitoring. Keywords: vendor PIA, processor assessment, DPA, Article 28, sub-processor, cloud privacy, third-party risk.
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Map business processes as-is and to-be. Use when the user says "map the process", "draw the workflow", "BPMN diagram", "process flow", "swimlane", "how does this process work", "document the current process", "redesign this process", "process improvement", "value stream map", "workflow analysis" - even if they don't explicitly say "process mapper".
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Draft letters for seller-led M&A processes, including initial offer instructions, final bid requirements, and management meeting invitations. Organize deadlines, submission details, evaluation criteria, and meeting logistics into Word documents for client review.
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Add or verify model support in SGLang's Rust processor so chat requests produce the same prompt text and token IDs as Python. Use reference-generated test cases to find differences in tools, reasoning settings, conversation history, and errors.
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Turn descriptions and existing notes into a standard operating procedure, a document explaining how work gets done. Capture process flow, responsibilities, detailed steps, exceptions, and metrics so teams can use it for handoffs or audits.
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Diagnose frozen or slow Qwen Code sessions on the current machine by checking CPU and memory usage, process states, child processes, network connections, and debug logs. Receive a diagnostic report with suggested next steps, without stopping processes.
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Design n8n automations for incoming events, API connections, database synchronization, AI agents, scheduled tasks, and batch processing. Choose a suitable structure, plan error handling, check connections, test results, and review performance when processing large numbers of items.
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Explain which process holds a port or file lock, what started it, and what keeps it running. Uses the witr CLI to trace services, containers, and parent processes without stopping or changing anything.
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Provides guidance on the new System.Diagnostics.Process APIs introduced in .NET 11: Process.Run, Process.RunAndCaptureText, Process.StartAndForget, Process.ReadAllText/Bytes/Lines, KillOnParentExit, InheritedHandles, and StartDetached. USE FOR: starting, orchestrating, or capturing output from external processes in applications targeting net11.0 or later. DO NOT USE FOR: applications targeting .NET 10 or earlier, or basic pre-.NET 11 Process.Start usage without new APIs.
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Provides guidance on the new System.Diagnostics.Process APIs introduced in .NET 11: Process.Run, Process.RunAndCaptureText, Process.StartAndForget, Process.ReadAllText/Bytes/Lines, KillOnParentExit, InheritedHandles, and StartDetached. USE FOR: starting, orchestrating, or capturing output from external processes in applications targeting net11.0 or later. DO NOT USE FOR: applications targeting .NET 10 or earlier, or basic pre-.NET 11 Process.Start usage without new APIs.
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Guides the creation and review of data processing agreements under GDPR Article 28(3), covering all eight mandatory clauses. References the 2021 Standard Contractual Clauses and provides a compliance checklist for processor contracts. Activate when onboarding processors, reviewing DPAs, or auditing processor compliance. Keywords: DPA, data processing agreement, Article 28, processor, mandatory clauses, standard contractual clauses.
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半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判
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Documenting As-Is and To-Be business processes for a Salesforce project as swim-lane diagrams — one lane per actor, explicit decision points, parallel and exception/sad paths, and per-step automation-tier annotations that drive downstream build decisions. Trigger keywords: As-Is To-Be salesforce process, swim lane salesforce, business process map, automation candidate identification, sad path documentation, process actor mapping, manual residue. NOT for Opportunity stage and exit-criteria design — use admin/sales-process-mapping. NOT for picking Flow vs Apex for one requirement — use admin/process-automation-selection.
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Turns process notes, a walkthrough or interview transcript, a transcript of a meeting recording or a stale existing procedure into a draft standard operating procedure: purpose and trigger, scope, definitions, roles with a RACI table, numbered steps with the check that closes each one, records produced, controls as stated, and open questions for the process owner. Every step traces to the source or reads UNKNOWN. Use when the user asks to "write an SOP from these notes", "turn this walkthrough into a procedure", "document how we do this", "draft the standard operating procedure for", "build a RACI for this process" or "tidy up this old procedure". Do not use for technical runbooks with commands and rollback, use runbook-drafter instead; for meeting minutes and action lists, use transcript-to-actions. Drafts for human review; never approves, authorises or signs off.
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Manage Node.js processes through PM2 from the command line. List running processes, start or restart applications, inspect logs and metrics, and save the process list, with structured JSON output for agent workflows.
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