「cad」の検索結果

Use for social science academic paper drafting, outlining, diagnosis, review, and revision. Trigger for topic diagnosis, research question refinement, literature review planning, CNKI/Google Scholar literature search-to-Zotero workflows, structured paper reading notes, theoretical framework design, research design critique, draft review, section or paragraph revision, citation and evidence risk checking, causal-claim checking, and pre-submission review. Do not use for purely creative writing or non-academic editing.

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Polish, translate, diagnose, and restructure technical manuscript text into IEEE-style academic English using routed failure-mode guidance. Use for IEEE abstracts, introductions, related work, methods, experiments, conclusions, figure captions, rebuttals, Chinese-to-English technical writing, AI-like or template-like academic prose, and engineering prose that needs clearer problem logic, contribution framing, method rationale, evidence discipline, natural author voice, or reviewer-ready wording.

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Convert CAD/BIM files to structured data. Extract element data from Revit, IFC, DWG, DGN files.

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Batch convert multiple CAD/BIM files (Revit, IFC, DWG, DGN) with progress tracking, error handling, and consolidated reporting.

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Searches academic literature via arXiv, Semantic Scholar, and open-access PDFs. Use when building literature reviews or finding formal research on a topic.

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Cascades a rebase through an entire PR stack after a base PR merges or upstream changes. Use when a stack needs to incorporate new base branch commits.

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ICS/SCADA/OT exploitation - Modbus (502), S7comm (102), EtherNet/IP (44818), DNP3, OpenPLC, Node-RED SCADA, PLC/HMI/coil/holding-register attacks. Use when a target exposes industrial protocols or the goal is to drive a plant to a dangerous state (over-pressure/over-speed/disable interlock) and read the flag the HMI/CCTV reveals.

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Implementation guide for GDPR Article 7(3) consent withdrawal mechanisms. Covers the equal ease requirement ensuring withdrawal is as easy as giving consent, one-click withdrawal implementation, cascading effects on downstream processing, third-party notification workflows, and technical architecture for real-time consent revocation.

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Publication-figure overlay for draw.io. Use instead of drawio whenever the diagram is for a paper, thesis, dissertation, journal, conference, IEEE/ACM submission, manuscript, camera-ready, Word/LaTeX figure, or other publication. Applies venue, figure-type, color, caption/legend, formula, and paper-readability gates for architecture, workflow, roadmap, network-topology, and replicated paper figures.

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Structured peer-review of academic papers.

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Research emerging academic trends by combining scholarly databases, web sources, and news to identify rising research areas, breakthrough papers, and shifting scientific consensus. Ideal for R&D teams tracking frontier science.

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Query Reactome for biological pathways and reactions. Use when user asks about signaling cascades, biological processes, pathway diagrams, or reaction details. Triggers on "reactome", "signaling cascade", "biological pathway", "pathway diagram", "reaction mechanism".

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CesiumJS models, glTF, and particle effects - Model, KHR_meshopt_compression, CAD glTF extensions, EdgeDisplayMode, ModelAnimation, ModelNode, ParticleSystem, emitters, GPM extensions. Use when loading compressed or CAD-style glTF/GLB models, controlling edge rendering, playing model animations, positioning particles, or working with geospatial positioning metadata.

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CesiumJS 3D Tiles - Cesium3DTileset, compressed and CAD-style glTF content, MVTDataProvider, UrlTemplate3DTilesDataProvider, styling, metadata, feature picking, voxels, point clouds, I3S, Gaussian splats, clipping. Use when a task involves loading 3D Tiles or Mapbox Vector Tiles, draping vector tiles on terrain, rendering KHR meshopt/CAD content, styling or querying features, working with voxels or point clouds, or clipping spatial data.

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Establish weekly customer-discovery cadence and Opportunity Solution Tree practice using Teresa Torres's Continuous Discovery Habits framework during PRD v1.0 Market Adoption. Triggers on requests to set up discovery cadence, build opportunity solution tree, run weekly customer interviews, or when user asks "Torres", "continuous discovery", "opportunity solution tree", "outcomes vs outputs", "weekly interviews", "assumption mapping". Outputs CFD-* discovery entries and updates to ADO-STAGE-* and PER-* with new evidence.

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Detect AI-generated text using rule-based analysis, LLM-as-judge scoring, and optional external APIs. Use when: auditing content for AI authorship, academic integrity checks, editorial review, SEO content audits.

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De-slop pass for any text. Scans for the statistical fingerprints of AI writing (negative parallelism / "not X but Y", em-dash density, rule-of-three, false ranges, puffery vocabulary, uniform cadence, hedged both-sidesing), rewrites by meaning, then re-scans until the text is clean and sits in the right register for its genre: academic article, tweet, reddit post, email, blog, docs, marketing. Use when the user says "deslopify", "deslop", "de-slop this", "remove the AI tells", "humanize this", "make this not sound like AI", or invokes /deslopify. Also use before publishing any agent-drafted prose.

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半导体芯片制造工艺 (Semiconductor Process Engineering / 半导体芯片制造工艺 — 以「物理化学极限 + 良率经济双重约束」为特征的集成电路前道/后道制造工艺认知操作系统：从「器件架构与微缩路线（planar→FinFET→GAA nanosheet→CFET、等效微缩 DTCO/STCO、背面供电 BSPDN）→ 工艺整合（FEOL/MOL/BEOL 模块协同、PDK、流片 tape-out）→ 单元工艺（光刻 litho（DUV 浸没式 193i / EUV 13.5nm / 多重曝光 SADP-SAQP / OPC / mask）、刻蚀 etch（RIE/ICP/原子层刻蚀 ALE）、薄膜沉积 depo（CVD/PECVD/LPCVD/ALD/PVD/外延 epi/电镀 Cu）、掺杂 doping（离子注入 ion implant / 退火 RTA-laser anneal）、CMP 化学机械抛光、清洗 cleaning）→ 量测检测 metrology（CD-SEM / OCD / overlay / 椭偏 ellipsometry / 缺陷检测 defect inspection / e-beam）→ 良率工程 yield（缺陷密度 / SPC 统计过程控制 / FDC / APC / DOE 实验设计 / 良率爬坡 yield ramp）→ 先进封装 advanced packaging（2.5D/3D、CoWoS、HBM、混合键合 hybrid bonding、chiplet、TSV）」的完整器件-工艺-良率-量产决策链。覆盖 (a) 第一性张力 — **物理/化学/材料的硬约束（量子隧穿、短沟道效应、RC 延迟、热预算、缺陷物理、ppb 级污染控制）⇄ 良率/成本/产能的经济约束（每片晶圆成本、良率是主经济指标、D0 缺陷密度、wafer-per-hour、折旧）**；**持续微缩/摩尔定律（dimensional + equivalent scaling、节点路线图 N5/N3/N2/A16/A14、high-NA EUV）⇄ 物理极限/微缩放缓（原子尺度、漏电、功耗墙、成本墙、'摩尔定律已死'之争）**；**协同优化/整合（DTCO 设计-工艺协同、STCO 系统-工艺协同、模块间 trade-off）⇄ 单模块极致优化（单一 unit process 工艺窗口）**；**工艺配方的 tacit 手艺（process recipe 调试、工艺窗口、缺陷根因分析、量产 ramp 的经验）⇄ 可建模/可仿真/数据驱动（TCAD 仿真、ML 良率分析、APC/FDC、数字孪生）**；**性能-功耗-面积-成本 PPAC 四角权衡 ⇄ 良率/可制造性 DFM 优先**；**自主可控/国产替代（卡脖子、EUV 出口管制、设备/材料/EDA 国产化、SMIC/长江存储/长鑫/中微/北方华创/上海微电子）⇄ 全球高度分工（ASML 光刻垄断、AMAT/Lam/TEL/KLA 设备、TSMC/Samsung/Intel 代工、全球供应链）**。(b) 核心工作流 / pipeline（最标准、最易蒸高质量 + CLI 化）— 新节点/新工艺导入：器件目标与 PPAC 定义 → 工艺整合方案与 PDK → 单元工艺开发与配方调试（DOE 找工艺窗口）→ 量测建立与 SPC → 良率爬坡（缺陷分类 + 根因分析 + 工艺改善）→ 量产移交与持续改善。具体单元工艺 SOP：光刻（曝光条件 / OPC / overlay 控制 / 多重曝光分解）、刻蚀（选择比 / profile / loading effect / ALE）、沉积（台阶覆盖 / 应力 / 均匀性）、CMP（去除速率 / 碟形 dishing / 侵蚀 erosion）、量测与缺陷分析、良率分析与 FA 失效分析。(c) 工具栈 — 设备（光刻 ASML/上海微电子 SMEE；刻蚀+沉积 AMAT/Lam/TEL/中微 AMEC/北方华创 Naura；离子注入 AMAT/Axcelis；CMP AMAT/荏原 Ebara；量测检测 KLA/AMAT/中科飞测/上海精测）、EDA/TCAD/仿真（Synopsys Sentaurus/Silvaco/Coventor SEMulator3D、OPC Calibre/Synopsys）、良率与制造软件（SPC、MES、FDC/APC、缺陷分析 yield management、PWS）、材料（光刻胶 photoresist、CMP 浆料 slurry、特气、靶材、掩膜 mask blank）。(d) 知识正典 — 半导体工艺 canon 横跨器件物理与制造工程：核心教材（Plummer/Deal/Griffin《Silicon VLSI Technology》、Sze《Physics of Semiconductor Devices》《VLSI Technology》、Wolf & Tauber《Silicon Processing for the VLSI Era》、Campbell《Fabrication Engineering at the Micro and Nanoscale》、May & Spanos《Fundamentals of Semiconductor Manufacturing and Process Control》、Quirk & Serda《Semiconductor Manufacturing Technology》、肖国勇/施敏中文教材）、路线图（ITRS/IRDS、IEEE 国际器件与系统路线图）、顶会论文（IEDM、Symposium on VLSI Technology、IRPS 可靠性、SPIE Advanced Lithography、ISSCC、DAC）、行业分析（SemiAnalysis、TechInsights、IC Knowledge）。(e) figures/流派 — 学术与器件奠基（Gordon Moore 摩尔、Robert Dennard 登纳德微缩、胡正明 Chenming Hu FinFET/UTB-SOI 发明人 UC Berkeley、刘明 Tsu-Jae King Liu Berkeley、Krishna Saraswat Stanford、Mark Bohr Intel 工艺架构）、产业领袖与工艺大师（张忠谋 Morris Chang TSMC、林本坚 Burn-Jeng Lin 浸没式光刻、Martin van den Brink ASML、米玉杰/梁孟松 SMIC/三星工艺、Mark Liu/魏哲家 TSMC）、行业分析师（Dylan Patel SemiAnalysis、Scotten Jones IC Knowledge、TechInsights 拆解、Handel Jones）、科普与拆解（Asianometry、The Chip Letter、半导体行业观察）。流派分歧：等效微缩派 vs 摩尔定律已死派、前道微缩 vs 先进封装 chiplet 异构集成、dimensional scaling vs DTCO 协同优化、IDM vs 纯代工 foundry 模式、自主可控/国产替代路线 vs 全球分工。(f) 行业话术/黑话 — 制程节点 node / 流片 tape-out / 工艺窗口 process window / 良率 yield / 缺陷密度 D0 / 关键尺寸 CD / 套刻 overlay / 掩膜 reticle-mask / 光刻胶 PR / 浸没式 immersion / EUV/DUV / 多重曝光 multi-patterning SADP-SAQP / OPC / 刻蚀选择比 selectivity / profile / loading effect / 原子层刻蚀 ALE / 台阶覆盖 step coverage / 外延 epi / 离子注入 implant / 退火 anneal / RTA / CMP / dishing-erosion / FEOL-MOL-BEOL / FinFET / GAA / 纳米片 nanosheet / CFET / 背面供电 BSPDN / high-NA / PPAC / DTCO-STCO / DFM / SPC / FDC-APC / DOE / WAT-PCM / 良率爬坡 yield ramp / FA 失效分析 / particle 颗粒 / 洁净室 cleanroom-级别 / 12寸-8寸 wafer / chiplet / CoWoS / HBM / 混合键合 hybrid bonding / TSV / PDK / 等效微缩. (g) 争议/批判 — 「摩尔定律是否已死 vs 等效微缩继续」、「节点命名营销化（N3/N2 ≠ 物理 3nm/2nm，gate pitch/metal pitch 才是真尺度）」、「前道微缩 vs 先进封装异构集成谁是未来」、「自主可控/国产替代的现实（EUV 卡脖子、设备/材料/EDA 国产化进度、出口管制 entity list、良率与成熟度差距）」、「良率/成本/性能三角权衡」、「人才稀缺与工艺 know-how 的 tacit 性」、「中国大基金/产能扩张是否过剩」、「制裁与技术封锁」。(h) 大量隐性工艺手艺（process recipe 调试与工艺窗口寻找、缺陷根因分析与 FA、量产良率爬坡的经验判

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Decide which model, effort level, and cascade shape each subagent gets, and how to keep improvement loops safe (evaluator-as-selector, stop on regression). Routes on measured cost-per-completed-task rather than per-token price, because a tier's token count varies more by task shape than price varies across tiers. Covers per-model effort semantics, the concision lever, cascade preconditions, context handoff, and watching a subagent fan-out live. Use when choosing a subagent's model or effort, when choosing how to escalate a failed attempt, or when asked which model or effort a task should get. Grounded in a 2026-07 calibration, a 2026-08 coding-cost study, a 2026-09 seeded-bug repair battery, a 2026-10 Haiku 5.5 ladder priced per spawn, and a 2026-10 retry-versus-escalation ladder on 295 SWE-bench Verified tasks; Managed Agents API specifics are operational, not calibrated.

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Strategic product leadership toolkit for Head of Product covering OKR cascade generation, quarterly planning, competitive landscape analysis, product vision documents, and team scaling proposals. Use when creating quarterly OKR documents, defining product goals or KPIs, building product roadmaps, running competitive analysis, drafting team structure or hiring plans, aligning product strategy across engineering and design, or generating cascaded goal hierarchies from company to team level.

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Format CVs for academic positions with publications, grants, and teaching

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Deterministic deep research via RivalSearchMCP. 9 tools: 5-engine web search (DuckDuckGo/Bing/Yahoo/Mojeek/Wikipedia), 9-platform social search (Reddit/HN/StackOverflow/Dev.to/Medium/ProductHunt/Bluesky/Lobste.rs/Lemmy), 5-source news (Google/Bing/Guardian/GDELT/DDG), 5 academic DBs (OpenAlex/CrossRef/arXiv/PubMed/EuropePMC), GitHub search, website mapping, content extraction with OCR, and research topic synthesis. No API keys required. Use when the user needs web research, competitive analysis, content discovery, or academic paper search.

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Apply the strategic thinking of Thai Lee, CEO of SHI International. Use this skill when the user is navigating bootstrapping vs. venture capital, long-term career sequencing, building an egalitarian corporate culture, or scaling a customer-centric B2B sales organization. Trigger this skill for topics involving decade-by-decade life planning, empowering employees with extreme ownership, or turning personal disadvantages into fuel for preparation. Apply her frameworks whenever these themes arise, even if the user doesn't explicitly name her.

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Create and render OpenSCAD 3D models. Generate preview images from multiple angles, extract customizable parameters, validate syntax, and export STL files for 3D printing.

日本語の概要は準備中です。原文の説明を表示しています。